Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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12/14/1993
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Application #:
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07958398
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Filing Dt:
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10/08/1992
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Inventors:
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CYNTHIA M. MELTON, KENNETH CHOLEWCZYNSKI, KEVIN D. MOORE, CARL RALEIGH
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Title:
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LOW TEMPERATURE METHOD FOR FORMING SOLDER BUMP INTERCONNECTIONS TO A PLATED CIRCUIT TRACE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| 1303 E. ALGONQUIN ROAD |
| CORPORATE OFFICES - INTELLECTUAL PROPERTY DEPARTMENT |
| SCHAUMBURG, ILLINOIS 60196 |
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| MARY GIFFORT |
| MOTOROLA, INC. |
| INTELLECTUAL PROPERTY DEPARTMENT |
| 1303 E. ALGONQUIN ROAD |
| SCHAUMBURG, IL 60196 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 1303 E. ALGONQUIN ROAD |
| IL01-11TH FLOOR |
| SCHAUMBURG, ILLINOIS 60196 |
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| MOTOROLA SOLUTIONS, INC. |
| 1303 E. ALGONQUIN ROAD |
| IL01-11TH FLOOR |
| SCHAUMBURG, IL 60196 |
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