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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
12/14/1993
Application #:
07814478
Filing Dt:
12/30/1991
Inventors:
KANESIGE TAKAYANAGI, TAKASHI ONO
Title:
RESIN MOLD FIELD EFFECT SEMICONDUCTOR DEVICE
Assignment: 1
Reel/Frame:
006472/0390Recorded: 03/26/1993Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST.
Assignors:
Exec Dt:
12/06/1991
Exec Dt:
12/06/1991
Assignee:
2-3, MARUNOUCHI, 2-CHOME, CHIYODA-KU
TOKYO, JAPAN
Correspondent:
OBLON, SPIVAK, MCCLELLAND,
MAIER & NEUSTADT, P.C.
ROBERT F. GNUSE
1755 JEFFERSON DAVIS HWY., FOURTH FLOOR
ARLINGTON, VIRGINIA 22202
Assignment: 2
Reel/Frame:
025980/0219Recorded: 03/18/2011Pages: 67
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
03/07/2011
Assignee:
1753, SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI,
KANAGAWA, JAPAN 211-8668
Correspondent:
MCDERMOTT WILL & EMERY LLP
600 THIRTEENTH STREET, N.W.
WASHINGTON, DC 20005-3096

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