Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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02/01/1994
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Application #:
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07672272
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Filing Dt:
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03/20/1991
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Inventors:
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FARID Y. AOUDE, EMANUEL I. COOPER, PETER R. DUNCOMBE, SHAJI FAROOQ, EDWARD A. GIESS et al
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Title:
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VIA PASTE COMPOSITIONS AND USE THEREOF TO FORM CONDUCTIVE VIAS IN CIRCUITIZED CERAMIC SUBSTRATES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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A CORPORATION OF NY |
ARMONK, NEW YORK 10504 |
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DAVID AKER |
IBM CORPORATION |
INTELLECTUAL PROPERTY LAW DEPT. |
P.O. BOX 218 |
YORKTOWN HEIGHTS, NY 10598 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST.
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A CORPORATION OF NY |
ARMONK, NEW YORK 10504 |
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DAVID AKER |
IBM CORPORATION |
INTELLECTUAL PROPERTY LAW DEPT. |
P.O. BOX 218 |
YORKTOWN HEIGHTS, NY 10598 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST.
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A CORPORATION OF NY |
ARMONK, NEW YORK 10504 |
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DAVID AKER |
IBM CORPORATION |
INTELLECTUAL PROPERTY LAW DEPT. |
P.O. BOX 218 |
YORKTOWN HEIGHTS, NY 10598 |
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Assignment:
4
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ASSIGNMENT OF ASSIGNORS INTEREST.
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DAVID AKER |
IBM CORPORATION |
INTELLECTUAL PROPERTY LAW DEPT. |
P.O. BOX 218 |
YORKTOWN HEIGHTS, NY 10598 |
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