Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/01/1994
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Application #:
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07907553
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Filing Dt:
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07/02/1992
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Inventors:
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HARUYUKI OCHIAI, SADATOSHI MURAKAMI, SETSUO HOSOGAI
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Title:
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LOW-SHRINKAGE UNSATURATED WET TYPE POLYESTER RESIN (B.M.C) FORMULATION COMPOSITION HAVING HIGH THERMAL CONDUCTIVITY AND MOLDED CIRCUIT BREAKER AND PARTS FORMED THEREFROM
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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2-3, MARUNOUCHI 2-CHOME |
CHIYODA-KU, TOKYO, JAPAN |
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LEYDIG, VOIT AND MAYER - MAURICE U. CAHN |
700 THIRTEENTH STREET, N.W. |
SUITE 300 |
WASHINGTON, DC 20005 |
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