Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/08/1994
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Application #:
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07939695
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Filing Dt:
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09/02/1992
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Inventors:
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TERU NAKANISHI, KAZUAKI KARASAWA, MASAYUKI OCHIAI, KAORU HASHIMOTO
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Title:
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PROCESS FOR FLIP CHIP CONNECTING SEMICONDUCTOR CHIP USING PERIPHERAL BREAKAWAY STUD BUMPS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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1015, KAMIKODANAKA NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA 211, JAPAN |
KANAGAWA 211, JAPAN, JAPAN |
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STAAS & HALSEY |
H. J. STAAS |
1825 K ST., NW |
WASHINGTON, DC 20006 |
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