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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/15/1994
Application #:
07990744
Filing Dt:
12/15/1992
Inventor:
HIRONOBU SHINOHARA
Title:
PACKAGING FOR SEMICONDUCTORS
Assignment: 1
Reel/Frame:
006633/0834Recorded: 08/04/1993Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/11/1992
Assignee:
2-11-24, TSUKIJI, SHUO-KU TOKYO, JAPAN
JAPAN
Correspondent:
SAMUEL H. BLECH
OBLON, SPIVAK, MCCLELLAND, MAIER
& NEUSTADT, P.C.
1755 JEFFERSON DAVIS HIGHWAY, 4TH FLOOR
ARLINGTON, VA 22202

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