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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/15/1994
Application #:
07970292
Filing Dt:
11/02/1992
Inventors:
SUSAN M. KEOWN, MYRON J. MISKE
Title:
INDIVIDUALIZED PREPACKAGE AC PERFORMANCE TESTING OF IC DIES ON A WAFER USING DC PARAMETRIC TEST PATTERNS
Assignment: 1
Reel/Frame:
006333/0062Recorded: 11/02/1992Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST.
Assignors:
Exec Dt:
10/30/1992
Exec Dt:
10/30/1992
Assignee:
2900 SEMICONDUCTOR DRIVE
SANTA CLARA, CALIFORNIA 95052-8090
Correspondent:
DANIEL H. KANE
FENTON, CHAPMAN, FENTON, ET AL.
109 MAIN ST., P.O. BOX B
BAR HARBOR, ME 04609

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