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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
5294835
Issue Dt:
03/15/1994
Application #:
07920657
Filing Dt:
07/28/1992
Inventors:
KAZUMASA IGARASHI, HIDETO KIMURA, MEGUMU NAGASAWA, TSUTOMU NISHIOKA, KAZUHIRO IKEMURA et al
Title:
EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE USING THE SAME
Assignment: 1
Reel/Frame:
006283/0487Recorded: 09/28/1992Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST.
Assignors:
IGARASHI, KAZUMASA
Exec Dt:
08/25/1992
KIMURA, HIDETO
Exec Dt:
08/25/1992
NAGASAWA, MEGUMU
Exec Dt:
08/25/1992
NISHIOKA, TSUTOMU
Exec Dt:
08/25/1992
IKEMURA, KAZUHIRO
Exec Dt:
08/25/1992
USUI, HIDEYUKI
Exec Dt:
08/25/1992
KOMOTO, MICHIO
Exec Dt:
08/25/1992
TABATA, HARUO
Exec Dt:
08/25/1992
ITO, SATOSHI
Exec Dt:
08/25/1992
Assignee:
NITTO DENKO CORPORATION
1-2, SHIMOHOZUMI 1-CHOME, IBARAKI-SHI
OSAKA, JAPAN
Correspondent:
SUGHRUE, MION, ZINN, MACPEAK & SEAS
2100 PENNSYLVANIA AVENUE, N.W.
SUITE 800
WASHINGTON, DC 20037-3202

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