Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/22/1994
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Application #:
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08082458
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Filing Dt:
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06/25/1993
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Inventor:
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TETU OHSAWA
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Title:
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METHOD OF HEAT TREATING SEMICONDUCTOR WAFERS BY VARYING THE PRESSURE AND TEMPERATURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-3-1, NISHI-SHINJUKU, TOKYO, JAPAN |
| JAPAN |
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| 52 AZAMATSUNAGANE, IWAYADO, ESASHI-SHI, IWATE-KEN, JAPAN |
| JAPAN |
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| C. IRVIN MCCLELLAND |
| OBLON, SPIVAK, MCCLELLAND,MAIER ET AL. |
| 4TH FLR., 1755 JEFFERSON DAVIS HWY. |
| ARLINGTON, VA 22202 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| MINATO-KU |
| 3-6 AKASAKA 5-CHOME |
| TOKYO 105, JAPAN |
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| OBLON, SPIVAK, MCCLELLAND, ET AL. |
| MARVIN J. SPIVAK |
| 1755 JEFFERSON DAVIS HWY., 4TH FLOOR |
| ARLINGTON, VA 22202 |
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