Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/17/1994
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Application #:
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07827195
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Filing Dt:
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01/28/1992
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Inventors:
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KLAUS D. BEYER, CHANG-MING HSIEH, LOUIS L. HSU, DAVID E. KOTECKI, TSORNG-DIH YUAN
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Title:
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THERMAL DISSIPATION OF INTEGRATED CIRCUITS USING DIAMOND PATHS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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A CORP. OF NEW YORK |
ARMONK, NEW YORK 10504 |
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RICHARD A. ROMANCHIK |
INTELLECTUAL PROPERTY LAW |
IBM CORP., DEPT. 18G |
BLDG. 300-482, RTE. 52 |
HOPEWELL JCT., NY 12533 |
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