Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
06/07/1994
|
Application #:
|
07826512
|
Filing Dt:
|
01/27/1992
|
|
Inventors:
|
SHINSUKE HAGIWARA, HIROYUKI KURIYA, SHIGEKI ICHIMURA
|
|
Title:
|
EPOXY RESIN MOLDING MATERIAL FOR SEALING OF ELECTRONIC COMPONENT
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST.
|
|
|
|
|
|
|
|
|
| 1-1 NISHISHINJUKU 2-CHOME, SHINJUKU-KU |
| TOKYO, JAPAN |
|
|
|
|
| ANTONELLI, TERRY, STOUT & KRAUS |
| SUITE 600 |
| 1919 PENNSYLVANIA AVE., N.W. |
| WASHINGTON, DC 20006 |
|
|
Search Results as of:
04/28/2024 05:48 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
