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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
06/28/1994
Application #:
08010964
Filing Dt:
01/28/1993
Inventors:
MANOJ F. NACHNANI, HEM P. TAKIAR
Title:
INTERCONNECTOR FOR A MULTI-CHIP MODULE OR PACKAGE
Assignment: 1
Reel/Frame:
006410/0612Recorded: 01/28/1993Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST.
Assignors:
Exec Dt:
01/22/1993
Exec Dt:
01/22/1993
Assignee:
2900 SEMICONDUCTOR DRIVE
SANTA CLARA, CALIFORNIA 95052
Correspondent:
RICHARD L. HUGHES
TOWNSEND AND TOWNSEND KHOURIE & CREW
STEUART STREET TOWER
ONE MARKET PLAZA, 20TH FLOOR
SAN FRANCISCO, CA. 94105-1492

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