Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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07/12/1994
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Application #:
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08080275
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Filing Dt:
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06/21/1993
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Inventors:
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TIMOTHY R. BLOCK, DAVID P. GAIO, RONALD L. SODERSTROM
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Title:
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HIGH-DENSITY PACKAGING FOR MULTIPLE REMOVABLE ELECTRONICS SUBASSEMBLIES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| OLD ORCHARD ROAD ARMONK, NY 10504 |
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| J. MICHAEL ANGLIN |
| IBM CORPORATION |
| DEPT. 917 |
| 3605 HIGHWAY 52 NORTH |
| ROCHESTER, MN 55901-7892 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 210 BAYPOINTE PARKWAY |
| SAN JOSE, CALIFORNIA 95134 |
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| JDS UNIPHASE CORPORATION |
| NEIL TEITELBAUM |
| 3000 MERIVALE ROAD |
| INTELLECTUAL PROPERTY DEPARTMENT |
| NEPEAN, ONTARIO K2G 6N7, CANADA |
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