Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/19/1994
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Application #:
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07962419
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Filing Dt:
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10/19/1992
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Inventors:
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MASAO KURODA, RYUJI IMAI, TOSHIYA ASANO
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Title:
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AN INTEGRATED CIRCUIT PACKAGE IN WHICH IMPENDANCE BETWEEN SIGNAL PADS AND SIGNAL LINES IS MATCHED BY REDUCING THE SIZE OF A GROUND PLANE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| 14-18, TAKATSUJI-CHO, MIZUHO-KU |
| NAGOYA-SHI, AICHI, JAPAN |
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| MELVA J. ARMAS |
| FINNEGAN, HENDERSON ET AL |
| 1300 I STREET, NW |
| WASHINGTON, DC 20005 |
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