Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/19/1994
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Application #:
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08036798
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Filing Dt:
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03/25/1993
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Inventors:
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SANG S. LEE, WILLIAM M. LOH
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Title:
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ELECTRICALLY AND THERMALLY ENHANCED INTEGRATED-CIRCUIT PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1109 MCKAY DRIVE, MS/45 |
| SAN JOSE, CALIFORNIA 95131 |
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| WILLIAM G. BECKER |
| VLSI TECHNOLOGY, INC. |
| 1109 MCKAY DRIVE, MS-45 |
| SAN JOSE, CA 95131 |
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