Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/09/1994
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Application #:
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08023106
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Filing Dt:
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02/26/1993
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Inventors:
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TETSUO KAWAKITA, TAKAYUKI YOSHIDA, KENZO HATADA
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Title:
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ELECTRONIC COMPONENTS MOUNTING/CONNECTING PACKAGE AND ITS FABRICATION METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| 1006, OHAZA KADOMA, KADOMA-SHI |
| OSAKA, JAPAN 571 |
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| ALLAN RATNER |
| RATNER & PRESTIA |
| 500 N. GULPH RD., P.O. BOX 980 |
| VALLEY FORGE, PA 19482 |
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