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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
09/20/1994
Application #:
08047399
Filing Dt:
04/19/1993
Inventor:
AKIRA SASAKI
Title:
LEAD FRAME AND SEMICONDUCTOR MODULE USING THE SAME HAVING FIRST AND SECOND ISLANDS AND THREE DISTINCT PLURALITIES OF LEADS AND SEMICONDUCTOR MODULE USING THE LEAD FRAME
Assignment: 1
Reel/Frame:
006530/0888Recorded: 04/19/1993Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST.
Assignor:
Exec Dt:
04/12/1993
Assignee:
72 HORIKAWA-CHO, SAIWAI-KU
KAWASAKI-SHI, JAPAN
Correspondent:
JOHN B.TURNER
MANAGER, FILING AND PROSECUTION DEPT.
FINNEGAN, HENDERSON, FARABOW, GARRETT &
DUNNER, 1300 I STREET, N.W.
WASHINGTON, D.C. 20005

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