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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
10/04/1994
Application #:
08082285
Filing Dt:
06/24/1993
Inventor:
HIROAKI KOBAYASHI
Title:
DIE BONDING APPARATUS
Assignment: 1
Reel/Frame:
006636/0813Recorded: 06/24/1993Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
06/21/1993
Assignee:
72, HORIKAWA-CHO, SAIWAI-KU
KAWASAKI-SHI, KANAGAWA-KEN, JAPAN
Correspondent:
SPENSLEY HORN JUBAS & LUBITZ
WILLIAM K. KONRAD
1880 CENTURY PARK EAST, SUITE 500
LOS ANGELES, CALIFORNIA 90067

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