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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
10/04/1994
Application #:
08023981
Filing Dt:
02/26/1993
Inventors:
CHOK J. CHIA, MANIAM ALAGARATNAM, QWAI H. LOW, SENG-SOOI LIM
Title:
HIGH POWER DISSIPATING PACKAGES WITH MATCHED HEATSPREADER HEATSINK ASSEMBLIES
Assignment: 1
Reel/Frame:
006494/0601Recorded: 02/26/1993Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST.
Assignors:
Exec Dt:
02/22/1993
Exec Dt:
02/22/1993
Exec Dt:
02/22/1993
Exec Dt:
02/22/1993
Assignee:
1551 MCCARTHY BLVD.
MILPITAS, CALIFORNIA 95035
Correspondent:
BRETON A. BOCCHIERI
POMS, SMITH, LANDE & ROSE
2121 AVENUE OF THE STARS #1400
LOS ANGELES, CA 90067-5010

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