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Patent Assignment Abstract of Title

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Total Assignments: 2

Patent #:	5357139	Issue Dt:	10/18/1994	Application #:	08117639	Filing Dt:	09/08/1993
Inventors:	AKIHIRO YAGUCHI, ASAO NISHIMURA, MAKOTO KITANO, RYUJI KOHNO, NAE YONEDA, ICHIRO ANJOH et al
Title:	PLASTIC ENCAPSULATED SEMICONDUCTOR DEVICE AND LEAD FRAME

Assignment: 1

Reel/Frame:

006703/0232

Recorded: 09/08/1993

Pages: 2

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

YAGUCHI, AKIHIRO

Exec Dt:

02/14/1991

NISHIMURA, ASAO

Exec Dt:

02/14/1991

KITANO, MAKOTO

Exec Dt:

02/14/1991

KOHNO, RYUJI

Exec Dt:

02/14/1991

YONEDA, NAE

Exec Dt:

02/14/1991

ANJOH, ICHIRO

Exec Dt:

02/14/1991

MURAKAMI, GEN

Exec Dt:

02/14/1991

Assignee:

HITACHI, LTD.

6, KANDA SURUGADAI 4-CHOME, CHIYODA-KU

TOKYO, JAPAN

Correspondent:

GREGORY E. MONTONE

ANTONELLI, TERRY, STOUT & KRAUS

1919 PENNSYLVANIA AVE., NW, STE. 600

WASHINGTON, D.C. 20006

Assignment: 2

Reel/Frame:

026109/0528

Recorded: 03/25/2011

Pages: 16

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignor:

HITACHI, LTD.

Exec Dt:

03/07/2011

Assignee:

RENESAS ELECTRONICS CORPORATION

1753 SHIMONUMABE, NAKAHARA-KU

KAWASAKI-SHI

KANAGAWA, JAPAN 211-8668

Correspondent:

ANTONELLI, TERRY, STOUT & KRAUS, LLP

1300 N. 17TH STREET, SUITE 1800

ARLINGTON, VIRGINIA 22209

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