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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/08/1994
Application #:
08066013
Filing Dt:
05/28/1993
Inventors:
HIROSHI KATAOKA, YUO UMEI
Title:
MOLD FOR SYNTHETIC RESIN MOLDING
Assignment: 1
Reel/Frame:
006693/0583Recorded: 05/28/1993Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/14/1993
Exec Dt:
05/14/1993
Assignee:
2-6, DOJIMAHAMA 1-CHOME, KITA-KU
OSAKA-SHI, OSAKA, JAPAN
Correspondent:
MR. JOHN B. TURNER
MANAGER, FILING AND PROSECUTION DEPT.
FINNEGAN, HENDERSON, FARABOW ET AL.
1300 I STREET, N.W.
WASHINGTON, D.C. 20005

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