Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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11/08/1994
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Application #:
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07970771
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Filing Dt:
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11/03/1992
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Inventor:
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GI B. CHA
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Title:
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SEMICONDUCTOR PACKAGE FOR A SEMICONDUTOR CHIP HAVING CENTRALLY LOCATED BOTTOM BOND PADS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| 50, HYANGJUNG-DONG, CHEONGJU |
| CHOONGCHUNGBOOK-DO, KOREA, REPUBLIC OF |
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| WILLIAM E. MCNULTY |
| SCULLY, SCOTT, MURPHY & PRESSER |
| 400 GARDEN CITY PLAZA |
| GARDEN CITY, NY 11530 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 1 HYANGJEONG-DONG, HEUNGDUK-KU, CEHONGJU |
| CHOONGCHEONGBUK-DO, KOREA, REPUBLIC OF |
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| ALAN R. LOUDERMILK |
| SUITE B |
| 10950 N. BLANEY AVE. |
| CUPERTINO, CA 95014 |
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