Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/15/1994
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Application #:
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07729226
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Filing Dt:
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07/12/1991
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Inventors:
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KATSUYUKI TOYOFUKU, ICHIRO NAGAMATSU, SHINJI SHIRAKAWA, HIROTO IGA, TAKESHI KUJIRAOKA et al
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Title:
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CLAD BONDING WIRE FOR SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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A CORPORATION OF JAPAN |
6-6 NIHONBASHI KAYABA-CHO 2-CHOME, CHUOH-KU |
TOKYO, JAPAN |
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SANDLER, GREENBLUM & BERNSTEIN |
2920 SOUTH GLEBE ROAD |
ARLINGTON, VA 22206 |
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