Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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11/15/1994
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Application #:
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08064235
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Filing Dt:
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05/21/1993
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Inventors:
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WOLFGANG HOENLEIN, VOLKER LEHMANN
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Title:
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MULTI-CHIP MODULE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| WITTELSBACHERPLATZ 2 |
| D8000 MUENCHEN, GERMANY |
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| RANDALL ERICKSON |
| HILL, STEADMAN & SIMPSON P.C. |
| 85TH FLOOR SEARS TOWER |
| 233 S. WACKER DRIVE |
| CHICAGO, IL 60606 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ST. MARTIN STR. 53 |
| 81541 MUENCHEN, GERMANY |
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| SCHIFF, HARDIN & WAITE |
| STEVEN H. NOIL |
| 6600 SEARS TOWER |
| 233 S. WACKER DRIVE |
| CHICAGO, IL 60606-6473 |
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