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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
12/13/1994
Application #:
07955307
Filing Dt:
10/01/1992
Inventors:
SHUNICHI ABE, KATUNORI ASAI, YOSHIHIRO TOMITA, HIDEYUKI ICHIYAMA, SEIZOU OHUMAE et al
Title:
SOLDER MATERIAL, JUNCTIONING METHOD, JUNCTION MATERIAL, AND SEMICONDUCTOR DEVICE
Assignment: 1
Reel/Frame:
006383/0871Recorded: 12/21/1992Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST.
Assignors:
Exec Dt:
11/10/1992
Exec Dt:
11/10/1992
Exec Dt:
11/10/1992
Exec Dt:
11/10/1992
Exec Dt:
11/10/1992
Exec Dt:
11/10/1992
Exec Dt:
11/10/1992
Exec Dt:
11/10/1992
Exec Dt:
11/10/1992
Exec Dt:
11/10/1992
Exec Dt:
11/10/1992
Exec Dt:
11/10/1992
Assignee:
2-2-3, MARUNOUCHI, CHIYODA-KU
TOKYO, JAPAN
Correspondent:
DAVID M. DRISCOLL
WOLF, GREENFIELD & SACKS, P.C.
FEDERAL RESERVE PLAZA, 600 ATLANTIC AVE.
BOSTON, MA 02210
Assignment: 2
Reel/Frame:
006498/0368Recorded: 04/19/1993Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST.
Assignor:
Exec Dt:
03/24/1993
Assignee:
NO. 1 MIZUHARA 4-CHOME ITAMI-SHI
HYOGO-KEN, JAPAN
Correspondent:
WOLF, GREENFIELD & SACKS, P.C.
DAVID M. DRISCOLL, ESQ.
FEDERAL RESERVE PLAZA
600 ATLANTIC AVENUE
BOSTON, MA 02210

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