Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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12/13/1994
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Application #:
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08053699
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Filing Dt:
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04/29/1993
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Inventor:
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HIDEKI ISHII
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Title:
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SOLDER REFLOW MOUNTING BOARD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-3, MARUNOUCHI 2-CHOME |
| CHIYODA-KU, TOKYO, JAPAN |
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| LEYDIG, VOIT & MAYER |
| JEFFREY A. WYAND |
| SUITE 300 |
| 700 THIRTEENTH STREET, N.W. |
| WASHINGTON, DC 20005 |
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Assignment:
2
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| 877 FIRST AVENUE, N.W. |
| SIOUX CENTER, IOWA 51520 |
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| TIMOTHY J. MARTIN, P.C. |
| 44 UNION BLVD., SUITE 620 |
| LAKEWOOD, CO 80228 |
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