Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/27/1994
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Application #:
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07818267
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Filing Dt:
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01/08/1992
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Inventors:
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SIEGFRIED RAUCHMAUL, HANS-FR. SCHMIDT, JUERGEN BEDNARZ, KARL-HEINZ HORSMANN et al
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Title:
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METHOD AND AN ENCAPSULATION FOR ENCAPSULATING ELECTRICAL OR ELECTRONIC COMPONENTS OR ASSEMBLIES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ST. MARTIN STR. 53 |
| 81541 MUENCHEN, GERMANY |
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| SCHIFF, HARDIN & WAITE |
| STEVEN H. NOIL |
| 6600 SEARS TOWER |
| 233 S. WACKER DRIVE |
| CHICAGO, IL 60606-6473 |
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