Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/03/1995
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Application #:
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08037059
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Filing Dt:
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03/25/1993
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Inventors:
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SANG S. LEE, GEORGE FUJIMOTO
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Title:
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DESIGN FOR ENCAPSULATION OF THERMALLY ENHANCED INTEGRATED CIRCUITS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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1109 MCKAY DRIVE, MS/45 |
SAN JOSE, CALIFORNIA 95131 |
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WILLIAM G. BECKER, ESQ. |
VLSI TECHNOLOGY, INC. |
1109 MCKAY DRIVE, MS-45 |
SAN JOSE, CA 95131 |
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