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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/21/1995
Application #:
07903725
Filing Dt:
06/24/1992
Inventor:
HIROFUMI SUMI
Title:
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE BY FORMING BARRIER METAL LAYER BETWEEN SUBSTRATE AND WIRING LAYER
Assignment: 1
Reel/Frame:
006168/0160Recorded: 06/24/1992Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST.
Assignor:
Exec Dt:
06/04/1992
Assignee:
7-35 KITASHINAGAWA-6
SHINAGAWA-KU, TOKYO, JAPAN
Correspondent:
HILL, VAN SANTEN, STEADMAN AND SIMPSON
85TH FLOOR SEARS TOWER
CHICAGO, IL 60606

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