Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/21/1995
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Application #:
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07903725
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Filing Dt:
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06/24/1992
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Inventor:
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HIROFUMI SUMI
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Title:
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METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE BY FORMING BARRIER METAL LAYER BETWEEN SUBSTRATE AND WIRING LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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7-35 KITASHINAGAWA-6 |
SHINAGAWA-KU, TOKYO, JAPAN |
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HILL, VAN SANTEN, STEADMAN AND SIMPSON |
85TH FLOOR SEARS TOWER |
CHICAGO, IL 60606 |
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