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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/18/1995
Application #:
08122052
Filing Dt:
09/15/1993
Inventor:
COURTNEY FURNIVAL
Title:
HIGH POWER SEMICONDUCTOR DEVICE MODULE WITH LOW THERMAL RESISTANCE AND SIMPLIFIED MANUFACTURING
Assignment: 1
Reel/Frame:
006701/0333Recorded: 09/15/1993Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
09/07/1993
Assignee:
233 KANSAS STREET
A CORPORATION OF DELAWARE
EL SEGUNDO, CALIFORNIA 90245
Correspondent:
SAMUEL H. WEINER
OSTROLENK, FABER, GERB & SOFFEN
1180 AVENUE OF THE AMERICAS
NEW YORK, NY 10036-8403

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