Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/09/1995
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Application #:
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08301186
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Filing Dt:
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09/06/1994
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Inventors:
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YOJI TOZAWA, SHIZUKI HASHIMOTO, TETSUYA YAMAMOTO
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Title:
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LID FOR SEMICONDUCTOR PACKAGE AND PACKAGE HAVING THE LID
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2701-1, AZA IWAKURA, HIGASHIBUN, OHMINE-CHO MINE-S |
| YAMAGUCHI, JAPAN |
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| FLYNN, THIEL, BOUTELL & TANIS P.C. |
| 2026 RAMBLING ROAD |
| KALAMAZOO, MI 49008-1699 |
| ATTN: TERRYENCE F. CHAPMAN |
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