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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/30/1995
Application #:
08223642
Filing Dt:
04/06/1994
Inventors:
SALMAN AKRAM, WARREN M. FARNWORTH
Title:
METHOD OF PROVIDING ELECTRICAL INTERCONNECT BETWEEN TWO LAYERS WITHIN A SILICON SUBSTRATE, SEMICONDUCTOR APPARATUS, AND METHOD OF FORMING APPARATUS FOR TESTING SEMICONDUCTOR CIRCUIRTY FOR OPERABILITY
Assignment: 1
Reel/Frame:
006951/0411Recorded: 04/06/1994Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/04/1994
Exec Dt:
04/04/1994
Assignee:
2805 E. COLUMBIA RD.
BOISE, IDAHO 83706-9698
Correspondent:
MARK S. MATKIN
WELLS, ST. JOHN, ROBERTS, GREGORY &
MATKIN P.S.
W. 601 MAIN, SUITE 815
SPOKANE, WA 99201

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