Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/13/1995
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Application #:
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08215815
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Filing Dt:
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03/22/1994
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Inventor:
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KANAKO SAWADA
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Title:
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MANUFACTURING METHOD OF ENCAPSULATING SEMICONDUCTOR DEVICE USING TWO RESIN SHEETS HAVING CONVEX PORTIONS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 72 HORIKAWA-CHO, SAIWAI-KU |
| KAWASAKI-SHI, JAPAN |
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| FINNEGAN, HENDERSON, FARABOW, GARRETT & |
| DUNNER - JOHN B. TURNER |
| MANAGER, FILING AND PROSECUTION DEPT. |
| 1300 I STREET, N.W. |
| WASHINGTON, D.C. 20005 |
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