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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
5430330
Issue Dt:
07/04/1995
Application #:
08077762
Filing Dt:
06/18/1993
Inventors:
SHINOBU TAKAHAMA, AKINOBU TAMAKI, SATOSHI HIRAKAWA, HITOSHI YAMANO, TERUKI HYOUGATANI
Title:
SEMICONDUCTOR DEVICE, RESIN FOR SEALING SAME AND METHOD OF FABRICATING SAME
Assignment: 1
Reel/Frame:
006687/0052Recorded: 09/09/1993Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
TAKAHAMA, SHINOBU
Exec Dt:
05/13/1993
TAMAKI, AKINOBU
Exec Dt:
05/20/1993
HIRAKAWA, SATOSHI
Exec Dt:
05/13/1993
YAMANO, HITOSHI
Exec Dt:
05/20/1993
HYOUGATANI, TERUKI
Exec Dt:
05/20/1993
Assignee:
MITSUBISHI DENKI KABUSHIKI KAISHA
2-3, MARUNOUCHI, 2-CHOME, CHIYODA-KU
TOKYO 100, JAPAN
Correspondent:
MARVIN J. SPIVAK
OBLON, SPIVAK, MCCLELLAND, MAIER
& NEUSTADT, P.C.
1755 JEFFERSON DAVIS HIGHWAY, 4TH FLOOR
ARLINGTON, VA 22202

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