Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/08/1995
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Application #:
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08177380
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Filing Dt:
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01/05/1994
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Inventors:
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YOSHIHIRO TOMITA, SHUNICHI ABE
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Title:
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RESIN-PACKAGED SEMICONDUCTOR DEVICE WITH FLOW PREVENTION DIMPLES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-3, MARUNOUCHI 2-CHOME |
| CHIYODA-KU, TOKYO 100, JAPAN |
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| LEYDIG, VOIT & MAYER |
| JEFFREY A. WYAND |
| SUITE 300 |
| 700 THIRTEENTH STREET, N.W. |
| WASHINGTON, D.C. 20005 |
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