Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/15/1995
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Application #:
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07989956
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Filing Dt:
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12/10/1992
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Inventors:
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ICHIRO ANJOH, GEN MURAKAMI, MICHAEL A. LAMSON, KATHERINE G. HEINEN
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Title:
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PACKAGED SEMICONDUCTOR DEVICE AND A LEADFRAME THEREFOR HAVING A COMMON POTENTIAL LEAD WITH LEAD PORTIONS HAVING DUAL FUNCTIONS OF CHIP SUPPORT AND HEAT DISSIPATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 13500 N. CENTRAL EXPRESSWAY |
| DALLAS, TX 75265 |
| TEXAS |
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| WILLIAM I. SOLOMON |
| ANTONELLI, TERRY, STOUT & KRUAS |
| 1300 NORTH 17TH STREET, SUITE 1800 |
| ARLINGTON, VA 22209 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI |
| KANAGAWA 211-8668, JAPAN |
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| ANTONELLI, TERRY, STOUT & KRAUS, LLP |
| 1300 N. 17TH ST., SUITE 1800 |
| ARLINGTON, VA 22209 |
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