Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/05/1995
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Application #:
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08263729
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Filing Dt:
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06/22/1994
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Inventor:
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HIROFUMI ISHIDA
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Title:
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PLATING DEVICE FOR WAFER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6-6, NIHOMBASHI KAYABACHO |
| 2-CHOME |
| CHUO-KU, TOKYO, JAPAN |
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| MICHAEL D. BEDNAREK, ESQ. |
| SUITE 750 |
| 2001 L ST., NW |
| WASHINGTON, DC 20036 |
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