Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/12/1995
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Application #:
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08252697
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Filing Dt:
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06/02/1994
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Inventors:
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HIROKAZU TSUJI, SHIGEO YAMASHITA, YASUAKI OHNO
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Title:
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METHOD OF SOLDERING LEAD TERMINAL TO SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 26-10, TENJIN 2-CHOME |
| NAGAOKAKYO-SHI, KYOTO-FU, JAPAN |
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| OSTROLENK, FABER, GERB & SOFFEN |
| 1180 AVENUE OF THE AMERICAS |
| NEW YORK, NEW YORK 10036-8403 |
| ATTN: JAMES A. FINDER |
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