Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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09/19/1995
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Application #:
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08025050
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Filing Dt:
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03/01/1993
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Inventor:
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TOSHIKAZU YOSHIMIZU
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Title:
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MULTI-CHIP MODULE INTEGRATED CIRCUIT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-12-38, ESAKA-CHO, SUITA-SHI |
| OSAKA-FU, JAPAN |
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| THOMAS LANGER |
| FRISHAUF, HOLTZ, GOODMAN ET AL |
| 600 THIRD AVENUE, 30TH FLOOR |
| NEW YORK, NY 10016-2088 |
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Assignment:
2
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ASSIGNEE CHANGE OF ADDRESS
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| CENTRAL SHIN OSAKA BLDG. |
| 4-5-36, MIYAHARA, YODOGAWA-KU |
| OSAKA-SHI 532, JAPAN |
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| FRISHAUF HOLTZ GOODMAN LANGER & CHICK PC |
| THOMAS LANGER |
| 767 THIRD AVENUE |
| 25TH FLOOR |
| NEW YORK, NY 10017-2023 |
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