Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/17/1995
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Application #:
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08198359
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Filing Dt:
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02/18/1994
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Inventors:
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TAKAHIRO SHIBATA, FUTOSHI SONODA, KAZUO KIMURA, TOMIO SATOU, KOICHI ISHIKAWA
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Title:
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METHOD OF ELECTROPLATING LEAD PINS OF INTEGRATED CIRCUIT PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 14-18, TAKATSUJI-CHO, MIZUHO-KU |
| AICHI PREFECTURE |
| NAGOYA CITY, JAPAN |
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| FOLEY & LARDNER |
| RICHARD L. SCHWAAB |
| 3000 K STREET, N.W. |
| SUITE 500 |
| WASHINGTON, D.C. 2007-5109 |
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