Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/31/1995
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Application #:
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08196316
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Filing Dt:
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02/15/1994
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Inventors:
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RENSEI FUTATSUKA, SHUNICHI CHIBA, JUNICHI KUMAGAI
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Title:
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LEAD FRAME MATERIAL FORMED OF COPPER ALLOY FOR RESIN SEALED TYPE SEMICONDUCTOR DEVICES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 6-2, GINZA 1-CHOME CHUO-KU |
| TOKYO, JAPAN |
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| RICHARD S. BARTH |
| FRISHAUF, HOLTZ, GOODMAN & WOODWARD, P.C |
| 600 THIRD AVENUE, 30TH FLOOR |
| NEW YORK, NY 10016-2088 |
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