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Patent Assignment Abstract of Title

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Total Assignments: 1

Patent #:	5463248	Issue Dt:	10/31/1995	Application #:	08243864	Filing Dt:	05/17/1994
Inventors:	KEIICHI YANO, TAKASHI TAKAHASHI, KAZUO KIMURA, YOSHITOSHI SATO, KOUJI YAMAKAWA et al
Title:	SEMICONDUCTOR PACKAGE USING AN ALUMINUM NITRIDE SUBSTRATE

Assignment: 1

Reel/Frame:

007054/0166

Recorded: 07/14/1994

Pages: 4

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

YANO, KEIICHI

Exec Dt:

06/27/1994

TAKAHASHI, TAKASHI

Exec Dt:

06/28/1994

KIMURA, KAZUO

Exec Dt:

06/27/1994

SATO, YOSHITOSHI

Exec Dt:

06/29/1994

YAMAKAWA, KOUJI

Exec Dt:

06/27/1994

YAMAMOTO, TOSHISHIGE

Exec Dt:

06/20/1994

FUJII, MASAFUMI

Exec Dt:

06/20/1994

HASHIMOTO, SHIZUKI

Exec Dt:

06/16/1994

TAKAMICHI, HIROSHI

Exec Dt:

06/16/1994

Assignees:

KABUSHIKI KAISHA TOSHIBA

72, HORIKAWA-CHO, SAIWAI-KU, KAWASAKI-SHI

KANAGAWA-KEN, JAPAN

SUMITOMO METAL CERAMICS INC.

2701-1, AZA-IWAKURA, HIGASHIBUN, OMINE-CHO

MINE-SHI, YAMAGUCHI-KEN, JAPAN

Correspondent:

FINNEGAN, HENDERSON, FARABOW, GARRETT

& DUNNER - JOHN B. TURNER

MANAGER, FILING AND PROSECUTION DEPT.

1300 I STREET, N.W.

WASHINGTON, D.C. 20005

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