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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/07/1995
Application #:
08271669
Filing Dt:
07/07/1994
Inventors:
NOBUYUKI ARAKAWA, TAKASHI SEGAWA, MORIYOSHI KANEKO, KAZUKI MIYAIRI, KAZUTOSHI TAKAYAMA
Title:
MOLDING DIE FOR DISK SUBSTRATE
Assignment: 1
Reel/Frame:
007237/0570Recorded: 11/03/1994Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/25/1994
Exec Dt:
10/25/1994
Exec Dt:
10/25/1994
Exec Dt:
10/25/1994
Exec Dt:
10/25/1994
Assignees:
7-35 KITASHINAGAWA 6-CHOME
SHINAGAWA-KU, TOKYO,, JAPAN
2110, OOAZA MINAMIJO, SAKAKI-MACHI,
HANISHINA-GUN
NAGANO-KEN,, JAPAN
Correspondent:
RONALD P. KANANEN, ESQ.
MARKS & MURASE
SUITE 750, 2001 L STREET, N.W.
WASHINGTON, D.C. 20036

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