Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/21/1995
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Application #:
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08155798
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Filing Dt:
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11/23/1993
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Inventors:
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HARUO MISHINA, MASAFUMI WADA, MITUO FUKUDA, MASATO ITAGAKI, SHINYA YAMAMA
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Title:
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REFLOW SOLDERING APPARATUS FOR SOLDERING ELECTRONIC PARTS TO CIRCUIT SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3, KANDA SURUGADAI 4-CHOME CHIYODA-KU |
| TOKYO, JAPAN |
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| STANLEY A. WAL |
| ANTONELLI, TERRY, STOUT & KRAUS |
| 1919 PENNSYLVANIA AVENUE, N.W. |
| SUITE 600 |
| WASHINGTON, DC 20006 |
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