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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/13/1996
Application #:
08121675
Filing Dt:
09/15/1993
Inventor:
KEITH G. NEWMAN
Title:
METHOD OF MAKING INTEGRATED CIRCUIT PACKAGE HAVING MULTIPLE BONDING TIERS
Assignment: 1
Reel/Frame:
006702/0375Recorded: 09/15/1993Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
08/12/1993
Assignee:
1551 MCCARTHY BLVD.
M/S D-106
MILPITAS, CALIFORNIA 95035
Correspondent:
JOHN G. FLAIM
HONIGMAN, MILLER, SCHWARTZ AND COHN
3100 FIRST INTERSTATE BANK PLAZA
1000 LOUISIANA
HOUSTON, TEXAS 77002-5011

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