Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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04/02/1996
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Application #:
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08105547
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Filing Dt:
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08/12/1993
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Inventors:
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MICHAEL D. ROSTOKER, NICHOLAS F. PASCH
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Title:
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PROCESS FOR SOLDER BALL INTERCONNECTING A SEMICONDUCTOR DEVICE TO A SUBSTRATE USING A NOBLE METAL FOIL EMBEDDED INTERPOSER SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1551 MCCARTHY BLVD. |
| MILPITAS, CALIFORNIA 95035 |
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| GERALD E. LLNDEN |
| 3013 PIGEON HAWK COURT |
| ORLANDO, FL 32829 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 401 N. MICHIGAN AVE. |
| SUITE 1600 |
| CHICAGO, ILLINOIS 60611 |
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| CHAD S. HILYARD |
| 401 N. MICHIGAN AVE. |
| SUITE 1600 |
| CHICAGO, IL 60611 |
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Assignment:
3
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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| 225 W. WASHINGTON ST., 9TH FLOOR |
| CHICAGO, ILLINOIS 60606 |
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| JAVIER J. RAMOS |
| 1850 K STREET, NW, SUITE 1100 |
| MILBANK, TWEED, HADLEY & MCCLOY, LLP |
| WASHINGTON, DC 20006 |
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Assignment:
4
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RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
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| 401 N. MICHIGAN AVE., SUITE 1630 |
| CHICAGO, ILLINOIS 60611 |
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| 401 N. MICHIGAN AVE., SUITE 1630 |
| CHICAGO, ILLINOIS 60611 |
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| 401 N. MICHIGAN AVE., SUITE 1630 |
| CHICAGO, ILLINOIS 60611 |
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| JOSHUA GAMMON |
| 401 N. MICHIGAN AVE. |
| SUITE 1630 |
| CHICAGO, IL 60611 |
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