Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/02/1996
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Application #:
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08333155
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Filing Dt:
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11/01/1994
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Inventor:
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JIAYUAN FANG
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Title:
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METHOD FOR MODELING INTERACTIONS IN MULTILAYERED ELECTRONIC PACKAGING STRUCTURES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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TECHNOLOGY TRANSFER OFFICE |
P.O. BOX 9 |
ALBANY, NEW YORK 12201-0009 |
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MARK LEVY |
19 CHENANGO STREET, STE. 606 |
BINGHAMTON, NY 13901 |
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