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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
04/09/1996
Application #:
08272589
Filing Dt:
07/11/1994
Inventors:
CHRISTOPH WERNER, ALFRED KERSCH
Title:
METHOD FOR DEPOSITING A LAYER ON A SUBSTRATE WAFER WITH A SPUTTERING PROCESS
Assignment: 1
Reel/Frame:
007075/0157Recorded: 07/11/1994Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/29/1994
Exec Dt:
06/29/1994
Assignee:
WITTELSBACHERPLATZ 2
80333 MUNICH, GERMANY
Correspondent:
HILL, STEADMAN & SIMPSON P.C.
JOHN SIMPSON
85TH FLOOR SEARS TOWER
233 S. WACKER DRIVE
CHICAGO, IL 60606
Assignment: 2
Reel/Frame:
015386/0643Recorded: 11/18/2004Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/26/2004
Assignee:
ST.-MARTIN-STR. 53
MUNCHEN, GERMANY 81669
Correspondent:
SLATER & MATAIL, L.L.P.
IRA S. MATSIL
17950 PRESTON ROAD, SUITE 1000
DALLAS, TX 75252-5793
Assignment: 3
Reel/Frame:
023828/0001Recorded: 01/13/2010Pages: 398
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
04/25/2006
Assignee:
GUSTAV-HEINEMANN-RING 212
MUNICH, GERMANY 81739
Correspondent:
BARRY E. BRETSCHNEIDER
C/O MORRISON & FOERSTER LLP
1650 TYSONS BLVD. SUITE 400
MCLEAN, VA 22102

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