Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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04/23/1996
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Application #:
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08401832
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Filing Dt:
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03/10/1995
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Inventor:
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YAW-HUEY LAI
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Title:
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HEAT-DISSIPATING DEVICE FOR A CENTRAL PROCESSING UNIT CHIP
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2F, NO. 6 ALLEY 90 LANE 411, SEC 1, NEI-HU RD TAIPEI CITY, TAIWAN, R.O.C. |
| TAIPEI CITY,, TAIWAN |
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| J. GEORG SEKA |
| TOWNSEND AND TOWNSEND KHOURIE AND CREW |
| TWENTIETH FLOOR, STEUART STREET TOWER |
| ONE MARKET PLAZA |
| SAN FRANCISCO, CALIFORNIA 94105-1492 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 20-3, LANE 65, LIEN-CHENG RD. |
| CHUNGHO CITY, TAIPEI HSIEN, TAIWAN |
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| TOWNSEND AND TOWNSEND AND CREW LLP |
| J. GEORG SEKA |
| TWO EMBARCADERO CENTER, 8TH FLOOR |
| SAN FRANCISCO, CALIFORNIA 94111-3834 |
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