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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/23/1996
Application #:
08223979
Filing Dt:
04/06/1994
Inventors:
SUGURU FUJITA, KAZUAKI TAKAHASHI, MORIKAZU SAGAWA, HIROYUKI SAKAI, YORITO OTA et al
Title:
A MULTILAYER MICROSTRIP WIRING BOARD WITH A SEMICONDUCTOR DEVICE MOUNTED THEREON VIA BUMPS
Assignment: 1
Reel/Frame:
006954/0804Recorded: 04/06/1994Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/01/1994
Exec Dt:
04/01/1994
Exec Dt:
04/01/1994
Exec Dt:
04/01/1994
Exec Dt:
04/01/1994
Exec Dt:
04/01/1994
Assignee:
1006, OAZA KADOMA
KADOMA-SHI
OSAKA, JAPAN
Correspondent:
MARC A. ROSSI
PARKHURST, WENDEL & ROSSI
1421 PRINCE STREET, SUITE 210
ALEXANDRIA, VA 22314

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